SEMICONDUCTOR FOUNDRY PLATFORM

Heterogeneous Material H-cut/
Thinning Route Full-process Foundry Services

Empowering Every Nanometer from Lab to Production

iSABer Foundry Platform integrates process manufacturing, power systems, and auxiliary facilities into one complete operation. With Class 10 and Class 100 cleanrooms spanning over 2,000 square meters, the platform is equipped with hundreds of cutting-edge international tools and staffed by 50+ professional engineers.

Specializing in H-cut and thinning-bonding route processes, we focus on heterogeneous integration of semiconductor and pan-semiconductor materials, supporting 4/6/8-inch full-scale wafer processing. Our highly customizable services, backed by mature processes and consistent quality, empower both academic research and industrial enterprises to overcome chip R&D challenges.